Samsung, SKHY to supply 8-layer HBM4 to Nvidia in February
Summary
Samsung and SK Hynix have announced plans to mass produce and ship 8-layer HBM4 memory chips directly to Nvidia, starting in February 2026. This development comes ahead of the scheduled mass production timeline, which originally aimed for the second quarter of 2027 for Rubin Ultra NVL systems. By securing this supply early, Nvidia ensures access to next-generation memory ahead of competitors.
Tokens
$SKHY$NVDA
Analysis
Nvidia: Nvidia is a major technology company focused on graphics processing units and AI accelerators that rely on advanced high-bandwidth memory solutions. The company is positioned to receive direct shipments of next-generation 8-layer HBM4 from the Samsung partnership to support its upcoming systems. Samsung: Samsung Electronics is a leading South Korean technology company and one of the world's largest semiconductor manufacturers, specializing in memory chips including high-bandwidth memory (HBM) products. In the context of this news, Samsung is partnering to mass produce and supply 8-layer HBM4 memory directly to Nvidia starting in February. {"Custom HBM Manufacturing": "Samsung has agreed to use TSMC's 3nm process for producing base dies in Nvidia's custom NVHBM architecture to standardize performance across suppliers."}
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